Multilayer ceramic electronic component and method of manufacturing the same

ABSTRACT

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by T d  and the thickness of the internal electrode is denoted by T e , 0.5≦T e /T d ≦2.0, and when the thickness of a central portion of the ceramic body is denoted by T m  and the thickness of each of side portions of the ceramic body is denoted by T a , 0.9≦T a /T m ≦0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2012-0016309 filed on Feb. 17, 2012, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a multilayer ceramic electroniccomponent and a method of manufacturing the same, and more particularly,to a multilayer ceramic electronic component having low equivalentseries inductance (ESL).

2. Description of the Related Art

Recently, as the trend has been for electronic products to be smallerand have a higher capacitance, electronic components used in electronicproducts have correspondingly been required to be smaller and have ahigher capacitance. Accordingly, the need for multilayer ceramicelectronic components is increasing.

In the case of multilayer ceramic capacitors, increased equivalentseries inductance (hereinafter, “ESL”) may cause a deterioration inelectronic product performance, and as electronic components come to besmaller and a higher capacitances, the effects of increased ESL indeteriorating electronic component performance have increased.

A so-called “low inductance chip capacitor (LICC),” decreases a distancebetween external terminals, and thus a current flow path, therebyreducing inductance of capacitance.

However, when a lead-out portion of an internal electrode is compressed,in order to reduce a difference in electrode density between acapacitance part and the lead-out portion of the internal electrode, theinternal electrode may be broken or bent, and thus, a current flow paththerein may be significantly increased, resulting in increased ESL.

RELATED ART DOCUMENTS

-   Korean Patent No. 10-0271910-   Korean Patent Laid-Open Publication No. 2003-0014712

SUMMARY OF THE INVENTION

An aspect of the present invention provides a multilayer ceramicelectronic component having relatively low equivalent series inductance(ESL) and a method of manufacturing the same.

According to one aspect of the present invention, there is provided amultilayer ceramic electronic component, including: a ceramic bodyhaving external electrodes; and internal electrodes disposed betweenceramic layers within the ceramic body, wherein, when a direction inwhich the external electrodes are connected and extended is denoted as a

width direction

; a direction in which the internal electrodes are laminated is denotedas a ┌thickness direction┘; and a direction perpendicular to the widthdirection and the thickness direction is denoted as a ┌lengthdirection┘, the ceramic body has a width smaller than a length thereof,the number of the internal electrodes laminated is 250 or more, when thethickness of the ceramic layer is denoted by T_(d) and the thickness ofthe internal electrode is denoted by T_(e), 0.5≦T_(e)/T_(d)≦2.0, andwhen the thickness of a central portion in a width direction of theceramic body is denoted by T_(m) and the thickness of each of sideportions of the ceramic body is denoted by T_(a), in a cross section ina width-thickness direction of the ceramic body, 0.9≦T_(a)/T_(m)≦0.97.

The central portion in the width direction of the ceramic body may bewithin sections inside 15% of the width of the ceramic body on bothsides of a center of the ceramic body in the width direction.

The side portion of the ceramic body may be a section within 10% of thewidth of the ceramic body from each side of the ceramic body in thewidth direction.

The internal electrode may include a capacitance formation portionforming capacitance by overlapping the internal electrode and anadjacent internal electrode, and a lead-out portion extended from thecapacitance formation portion and led out to an outside of the ceramicbody, the lead out portion being thicker than the capacitance formationportion.

The external electrodes may be extended onto side surfaces opposing eachother in the width direction of the ceramic body and onto portions ofthe other surfaces adjacent to the side surfaces.

The thickness of the ceramic layer may be a thickness of the ceramiclayer disposed between capacitance formation portions of adjacentinternal electrodes.

The thickness of the internal electrode may be a thickness of thecapacitance formation portion of the internal electrode.

The cross section in the width-thickness direction may be located withinsections inside 40% of the length of the ceramic body on both sides ofthe center of the ceramic body in the length direction.

According to another aspect of the present invention, there is provideda method of manufacturing a multilayer ceramic electronic component, themethod including: preparing a cuboid green chip by laminating 250 ormore layers of internal electrodes each interposed between ceramiclayers, the cuboid green chip having a smaller width than a lengththereof; compressing side portions in a width direction of the greenchip such that a ratio of a thickness of a compressed portion to athickness of an uncompressed portion is 0.9-0.97; sintering the greenchip; and forming external electrodes on side surfaces in a widthdirection of the sintered chip.

In the preparing of the green chip, adjacent internal electrodes may beexposed to opposing surfaces of the green chip, respectively.

In the preparing of the green chip, the internal electrode may be formedsuch that a lead-out portion thereof is thicker than a capacitanceformation portion thereof.

In the compressing, the compression may be performed in a laminationdirection of the internal electrodes.

In the forming of the external electrodes, the external electrodes maybe extended to portions of the other surfaces adjacent to the sidesurfaces in the width direction.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view of a multilayer ceramic electroniccomponent according to an embodiment of the present invention;

FIG. 2 is a schematic view of a ceramic body according to an embodimentof the present invention;

FIG. 3 is an exploded perspective view of FIG. 2;

FIG. 4 is a cross-sectional view taken along the line X-X′ of FIG. 1;

FIGS. 5A, 5B, 6A, 6B, 7A, and 7B are schematic views showingmodifications of internal electrodes according to embodiments of thepresent invention; and

FIG. 8 is a schematic view showing measurement of thicknesses of aceramic layer and an internal electrode.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments of the present invention will now be described in detailwith reference to the accompanying drawings.

However, the invention may be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein.

The embodiments of the present invention are provided so that thoseskilled in the art may more completely understand the present invention.

In the drawings, the shapes and dimensions of elements maybe exaggeratedfor clarity, and the same reference numerals will be used throughout todesignate the same or like components.

There may be provided, as multilayer ceramic electronic components,multilayer ceramic capacitors, multilayer chip inductors, chip beads,chip varistors, and the like.

Hereinafter, embodiments of the present invention will be described indetail with reference to a multilayer ceramic capacitor, but the presentinvention should not be seen as being limited thereto.

FIG. 1 is a perspective view of a multilayer ceramic electroniccomponent according to an embodiment of the present invention; FIG. 2 isa schematic view of a ceramic body according to an embodiment of thepresent invention; FIG. 3 is an exploded perspective view of FIG. 2;FIG. 4 is a cross-sectional view taken along line X-X′ of FIG. 1; FIGS.5 to 7 are schematic views showing modifications of internal electrodesaccording to an embodiment of the present invention; and FIG. 8 is aschematic view showing measurement of thicknesses of a ceramic layer andan internal electrode.

Referring to FIG. 1, a multilayer ceramic electronic component accordingto an embodiment of the present invention may include a ceramic body 10and external electrodes 21 and 22.

As shown in FIG. 1, a ┌width direction┘ may denote a direction in whichthe external electrodes 21 and 22 are connected and extended (“Wdirection”); a ┌lamination direction┘ or ┌thickness direction┘ maydenote a direction in which the internal electrodes are laminated (“Tdirection”); and a ┌length direction┘ may denote a directionperpendicular to the width direction and the lamination direction (“L”direction”).

The ceramic body 10 may be formed of a ceramic material having arelatively high dielectric constant, and without limitation thereto, abarium titanate- or strontium titanate-based material or the like may beused.

The ceramic body 10 may be formed by laminating and then sintering aplurality of ceramic layers, which may be integrated in a single bodysuch that individual adjacent layers may not be readily differentiatedfrom one another.

The ceramic body 10 may be a parallelepiped. Specifically, the ceramicbody 10 may have a top surface S1 and a bottom surface S2 opposing eachother in a thickness direction, end surfaces S3 and S4 opposing eachother in a length direction, and side surfaces S5 and S6 opposing eachother in a width direction. However, the ceramic body 10 may notactually have an entirely cuboid shape due to manufacturing processerrors or the like.

The width of the ceramic body 10, that is, a distance between externalelectrodes 21 and 22, is smaller than the length thereof.

In a general laminate ceramic electronic component, external electrodesmay be disposed on the end surfaces in the length direction of theceramic body. In this case, since a current path may be elongated whenan alternating current is applied to the external electrodes, the largercurrent loop may be formed, and the magnitude of the induced magneticfield may be increased, resulting in an increase in inductance.

A distance between the external electrodes 21 and 22, across the ceramicbody 10, may be smaller than the length thereof in order to decrease thecurrent path. Hence, the distance between the external electrodes 21 and22 are small, resulting in a decrease in the current path, and thus, thecurrent loop may be reduced, thereby reducing inductance. As such, themultilayer ceramic electronic component of which the distance betweenthe external electrodes 21 and 22 is smaller than the length thereof maybe referred to as a reverse geometry capacitor (RGC) or a low inductancechip capacitor (LICC).

The number of laminated internal electrodes may be 250 or greater.

The defect of an increase in ESL may occur only when the number oflaminated internal electrodes 31 and 32 is 250 or greater. The presentembodiment is provided to solve this defect, which will be describedwith reference to Table 1.

The ratio (T_(e)/T_(d)) of a thickness (T_(e)) of the internal electrode31 or 32 to a thickness (T_(d)) of the ceramic layer 11 may be 0.5-2.0or less.

When the ratio T_(e)/T_(d) is smaller than 0.5, a defect such ascracking or delamination may not occur. When the ratio T_(e)/T_(d) is0.5 or greater, the defect of cracking or delamination may occur atfirst. The present embodiment is provided to solve these defects.

When the ratio T_(e)/T_(d) is greater than 2.0, the thickness of theinternal electrode 31 or 32 is much greater than the thickness of theceramic layer 11, and thus, cracking or delamination may not beprevented, even when other factors are changed.

Defects such as cracking or delamination, which may occur with respectto the ratio (T_(e)/T_(d)) of the thickness (T_(e)) of the internalelectrode to the thickness (T_(d)) of the ceramic layer, will beexplained as follows.

The coefficient of thermal expansion of the internal electrode may belarger than that of the ceramic layer due to the internal electrodes 31and 32 containing a conductive metal. Stress may therefore beconcentrated on an interface between the inner electrode 31 or 32 andthe ceramic layer 11 due to repeated expansion and shrinkage throughheat history, finally resulting in cracking or delamination.

In cases in which the ratio of the thickness of the internal electrodeto the thickness of the ceramic layer is relatively low, stress that maycause cracking or delamination may not be generated due to relativelysmall degrees of expansion and shrinkage of the internal electrode,hence the defect of cracking or delamination may not occur.

However, in cases in which the ratio of the thickness of the internalelectrode to the thickness of the ceramic layer is large, the percentageof the internal electrodes in the ceramic body 10 is larger, and thus,thermal expansion and shrinkage of the internal electrodes may belarger. Therefore, cracking or delamination may occur.

The thickness (T_(d)) of the ceramic layer 11 may refer to an averagethickness of the ceramic layer 11 disposed between the internalelectrodes 31 and 32.

The average thickness of the ceramic layer 11 may be measured from animage obtained by scanning a cross section in a width-thicknessdirection of the ceramic body 10 at a magnification of 10,000 timesusing a scanning electron microscope (SEM), as shown in FIG. 8.

Specifically, an average thickness value of the ceramic layer 11 may beobtained by measuring the thicknesses of 30 regions of the ceramic layer11 that are equidistant in a width direction, on the scanned image, andthen averaging the measured thicknesses.

The 30 regions that are equidistant may be extracted from thecapacitance formation portion (P).

In addition, when this method for average measurement is extensivelyperformed on ten ceramic layers 11 and an average thereof is calculated,the average thickness (T_(d)) of the ceramic layer 11 may be furthergeneralized.

The thickness (T_(e)) of the internal electrode 31 or 32 may be thethickness of a capacitance formation portion P of the internal electrode31 or 32.

The delamination between the internal electrode 31 or 32 and the ceramiclayer 11 due to a difference in a coefficient of thermal expansionbetween the internal electrode 31 or 32 and the ceramic layer 11 mayeasily occur in the capacitance formation portion P having relativelyhigh electrode density, and thus, the thickness of the capacitanceformation portion P of the internal electrode needs to be controlled.

In an area in which lead-out portions of the internal electrodes 31 or32 overlap each other and thus electrode density is low, since thepercentage of the internal electrodes 31 or 32 is relatively small inthe ceramic body 10, delamination due to a difference in a coefficientof thermal expansion between the internal electrode 31 or 32 and theceramic layer 11 may occur relatively less.

When, in a cross section in the width-thickness direction (W-T crosssection), the thickness of a central portion (E) in the width directionof the ceramic body 10 is denoted by T_(m) and the thickness of a sideportion (B) of the ceramic body 10 is denoted by T_(a),0.9≦T_(a)/T_(m)≦0.97 may be satisfied.

In the multilayer ceramic capacitor, the area in which the capacitanceformation portions (P) of the internal electrodes 31 and 32 overlap eachother is different from the area in which the lead-out portions (Q) ofthe internal electrodes 31 or 32 in view of density of the internalelectrode. That is to say, the area in which the capacitance formationportions (P) overlap each other is greater than the area in which thelead-out portions are formed, in view of electrode density.

Here, electrode density may refer to the percentage of the area of theinternal electrodes 31 and 32 in the overall area of the cross sectionin the width-thickness direction (W-T cross section).

In order to reduce a difference in electrode density of the internalelectrodes 31 and 32, the area (Q′) in which the lead-out portions (Q)overlap each other may be compressed. The compression may be performedfor an appropriate time period and at an appropriate pressure,considering the thickness of the internal electrodes 31 and 32, thethickness of the ceramic layer 11, the dimensions of the ceramic body10, and the like.

The internal electrodes 31 and 32 may be broken or bent at a boundarybetween the compressed portion (B) and the uncompressed portion A. Inthis case, a current path and the current loop may further increased,resulting in an increase in ESL.

This phenomenon may occur relatively more in the case of RGC or LICC inwhich a distance between the external electrodes 21 and 22 is relativelyshort.

The thickness (T_(m)) of the central portion (E) of the ceramic body 10may be defined by a distance from the lowest point protruding downwardlyto the highest point protruding upwardly in the central portion (E) inthe width direction of the ceramic body 10.

The central portion (E) in the width direction of the ceramic body 10,as shown in FIGS. 2 and 4, may be within sections inside 15% of thewidth of the ceramic body 10 on both sides of the center (C) of theceramic body 10 in the width direction.

The reason is that a middle portion A of the ceramic body 10 mayprotrude upwardly and downwardly since the side portions B thereof arecompressed, and here, the highest point and the lowest point of theprotruding portion may be formed within the above range.

Each of the side portions (B) of the ceramic body 10 may be a sectionwithin 10% of the width of the ceramic body 10 from each side of theceramic body 10 in the width direction.

The thickness of the side portion (B) of the ceramic body 10 may be anaverage thickness.

Since the ceramic body 10 is compressed above and below in a laminationdirection of the internal electrodes 31 and 32, the compressed sideportion (B) may be flat and the thickness from a bottom surface to a topsurface of the compressed portion (B) may be denoted by a thickness(T_(a)) of the side portion (B) of the ceramic body 10.

When T_(a)/T_(m) is smaller than 0.9, the current path and the currentloop may increase, resulting in an increase in ESL. When T_(a)/T_(m) isgreater than 0.97, delamination may occur.

When the ratio (T_(a)/T_(m)) of the thickness (T_(a)) of the sideportion (B) to the thickness (T_(m)) of the central portion (E) in thewidth direction of the ceramic body 10 is increased by strongcompression, binding strength between the internal electrodes 31 and 32and the ceramic layers 11 may be increased, but ESL may increase due toan increase in the current path.

On the contrary, in the case of relatively weak compression, the currentpath is only slightly increased, which may not cause the defect of anincrease in ESL, but binding strength between the internal electrodes 31and 32 and the ceramic layers 11 may be relatively reduced, which mayresult in delamination.

The cross section in the width-thickness direction (W-T cross section)may be located within sections inside 40% of the length of the ceramicbody 10 on both sides of the center (C) of the ceramic body 10 in thelength direction.

The reason is that the thickness (T_(d)) of the ceramic body 10 may bestable within the above range, but not stable outside of the aboverange.

The thicknesses of the both portions (B) of the ceramic body 10 may bethe same.

Tombstone defects may be prevented by forming the ceramic body 10 tohave a symmetrical structure.

The ceramic body 10, without being limited thereto, may include bariumtitanate or strontium titanate. A ceramic body 10 that can include aceramic material having a relatively high dielectric constant may beused.

When a dielectric material having a high dielectric constant is locatedbetween electrodes having different polarities, electric dipoles presentin the dielectric material may be arranged due to a reaction by anexternal electric field. Therefore, more charges may be induced in theelectrodes, and thus, more electrical energy may be accumulated.

The internal electrodes 31 and 32 may be laminated within the ceramicbody 10 such that each of the internal electrodes 31 and 32 may beinterposed between the ceramic layers 11.

The internal electrode 31 or 32 may include the capacitance formationportion (P) that contributes to capacitance formation by overlappingwith the adjacent internal electrode 31 or 32 and the lead-out portion(Q) that is extended from a portion of the capacitance formation portion(P) and led out to the outside of the ceramic body 10.

In each of the internal electrodes 31 and 32, the lead-out portion (Q)may be thicker than the capacitance formation portion (P).

As for the ceramic body 10, a region (P′) in which the capacitanceformation portions (P) overlap each other is higher than a region (Q′)in which the lead-out portions (Q) overlap each other in view ofelectrode density. Compression may be performed on the region (Q′) wherethe lead-out portions (Q) overlap each other in order to reduce thedifference in electrode density.

Apart from the compression, the lead-out portions (Q) of the internalelectrodes 31 and 32 may be thicker than the capacitance formationportions (P) thereof in order to reduce the difference in electrodedensity.

The internal electrodes 31 and 32 may be formed by a method such asscreen-printing a conductive paste or the like. The screen printing maybe performed several times for the lead-out portions (Q) of the internalelectrodes 31 and 32, thereby forming the lead-out portions (P) to bethicker than the capacitance formation portions (Q).

FIGS. 5 to 7 show modifications of the internal electrodes 31 and 32.

FIGS. 5A and 5B show cases in which the capacitance formation portions(P) of the internal electrodes 31 and 32 are extended to form thelead-out portions (Q) thereof, and FIGS. 6A and 6B show cases in whichthe lead-out portions (Q) are smaller than the capacitance formationportions (P). FIGS. 7A and 7B show cases in which each of the lead-outportions (Q) is divided into two. However, the shapes of the internalelectrodes 31 and 32 are not limited to the cases of FIGS. 5 to 7, andmay be varied as necessary.

Referring to FIG. 8, the thickness (T_(e)) of each of the internalelectrodes 31 and 32 may be measured from an image obtained by scanninga cross section in a width-thickness direction (W-T cross section) ofthe ceramic body 10 using a scanning electron microscope (SEM).

For example, as shown in FIG. 8, the average thickness of the internalelectrode 31 or 32 may be obtained by measuring the thicknesses of 30regions that are equidistant in a width direction, on an image of anyinternal electrode 31 or 32 extracted from the image obtained byscanning a cross section in a width-thickness direction (W-T crosssection), which is cut in the central portion (H) in a length directionof the ceramic body 10, at a magnification of 10,000 times using ascanning electron microscope (SEM), and then averaging the measuredthicknesses.

The central portion (H) in the length direction of the ceramic body 10,as shown in FIGS. 2 and 4, may be within sections inside 40% of thelength of the ceramic body 10 on both sides of the center (C) of theceramic body 10 in the length direction. The reason is that eachthickness (T_(e)) of the internal electrodes 31 and 32 has a stablevalue within the above-described range.

The 30 regions that are equidistant may be extracted from thecapacitance formation portion (P) of the internal electrode 31 or 32.

In addition, when this method for average measurement is extensivelyperformed on ten or more internal electrodes 31 or 32 and an averagethereof is calculated, the average thickness (T_(e)) of the internalelectrode 31 or 32 maybe further generalized.

The internal electrodes 31 and 32 may include at least one selected fromthe group consisting of gold, silver, copper, nickel, palladium, and analloy thereof. However, without being limited thereto, any metal thatcan confer conductivity to the internal electrodes 31 and 32 may beused.

Noble metals such as gold, silver, palladium and the like are expensive,but oxidation defects present do not need to be considered at the timeof sintering. Base metals such as nickel and the like are relativelycheap, and thus, may have strength in costs, but the sintering stateneeds to be maintained in a reduction atmosphere in order to preventoxidation of the metals.

The external electrodes 21 and 22 may be extended onto the side surfaces(S5 and S6) opposing each other in the width direction of the ceramicbody 10 and onto portions of the surfaces (S1 to S4) adjacent to theside surfaces (S5 and S6).

The external electrodes 21 and 22 may cover the compressed side portionsof the ceramic body 10.

The external electrodes 21 and 22 are not limited thereto, but mayinclude conductive metals such as copper and the like, and a glasscomponent may be further added thereinto in order to improve compactnessthereof.

According to another embodiment of the present invention, there isprovided a method of manufacturing a multilayer ceramic electroniccomponent, the method including: preparing a cuboid green chip bylaminating 250 or more layers of internal electrodes each interposedbetween ceramic layers, the cuboid green chip having a smaller widththan a length thereof; compressing side portions in a width direction ofthe green chip such that a ratio of thickness of a compressed portion tothickness of an uncompressed portion is 0.9-0.97; sintering the greenchip; and forming the external electrodes on side surfaces in a widthdirection of the sintered chip.

First, a cuboid green chip having a smaller width than a length thereofmay be prepared by laminating 250 or more layers of internal electrodeseach interposed between green ceramic layers.

A ceramic slurry may be prepared by mixing a ceramic powder, an organicsolvent, a binder, and the like and conducting ball milling, and then adoctor blade method or the like using the ceramic slurry may bepreformed to form thin green sheets.

A conductive paste including a conductive metal may be prepared in thesame manner as the ceramic slurry, and a screen printing method or thelike using the conductive paste may be performed to form the internalelectrodes on the green sheets, respectively.

250 or more layers of green sheets on which the internal electrodes havebeen formed may be laminated and compressed to form a green sheetlaminate, which may be then cut to manufacture the green chip.

The internal electrodes may be exposed to opposing surfaces of the greenchip, and a direction in which the surfaces to which the internalelectrodes are exposed are extended may be denoted by a width direction.The green chip may have a cuboid of which the width, that is, a distancebetween the external electrodes, is smaller than the length.

The reason for this is that a distance between external terminals isdecreased to reduce the current path, and thus, ESL may be reduced inthe capacitor. That is to say, the reason for the above-detailedconditions is for manufacturing an RGC or LICC.

The internal electrode may include a capacitance formation portioncontributing to capacitance formation and a lead-out portion extendedfrom the capacitance formation portion and led out to the outside of thegreen chip, and here, the lead out portion may be thicker than thecapacitance formation portion.

The reason is for reducing a difference in electrode density between aregion in which the capacitance formation portions overlap each otherand a region in which the lead out portions overlap each other.

Next, side portions in a width direction of the green chip may becompressed, and the compression may be performed in a laminationdirection of the internal electrodes.

In the green chip, the number of laminated internal electrodes in theregion in which the capacitance formation portions overlap each other is2 times the number of laminated internal electrodes in the region inwhich the lead out portions overlap each other, and thus the electrodedensity may be larger in the region in which the capacitance formationportions overlap each other than in the region in which the lead outportions overlap each other. The region in which the lead out portionsoverlap each other may be compressed in a thickness direction in orderto reduce a difference in electrode density.

However, when the compression is too large, the internal electrodes maybe excessively broken or bent proportionally, and thus the current pathmay be increased, resulting in an increase in ESL. When the compressionis too small, binding strength between the green ceramic layer and theinternal electrode may not be sufficient, resulting in delamination. Theabove defects may not occur when the ratio of thickness of thecompressed portion to thickness of the uncompressed portion in the greenchip is 0.9-0.97.

Then, the green chip may be sintered.

Before sintering, a calcining process may be performed at a temperaturelower than the sintering temperature. The organic materials present inthe green chip may be removed by the calcining process. In the case inwhich a base metal such as nickel or the like is used for the internalelectrode, the internal electrode may be oxidized to reduce conductivitythereof, and thus, sintering may need to be performed at the reductionatmosphere.

Then, external electrodes may be formed on side surfaces in a widthdirection of the sintered chip. The external electrodes may be extendedto portions of the other surfaces adjacent to the side surfaces in thewidth direction of the sintered chip. The external electrodes may beformed by a printing or dipping method using a paste including aconductive metal. Here, a glass component may be further added into thepaste, thereby to improve compactness of the external electrode, andprevent infiltration of a plating liquid during a plating process whichwill be performed later.

Then, plating layers may be formed on the external electrodes for easysoldering. The plating layers may be nickel or tin plating layers.

The ceramic body may include barium titanate.

The internal electrodes may include at least one selected from the groupconsisting of gold, silver, copper, nickel, palladium, and an alloythereof.

The external electrodes may include copper.

Other details of the ceramic body, the internal electrodes, the externalelectrodes, and the like are the same as described above.

Hereinafter, the present invention will be described with reference toinventive examples and comparative examples.

Each of multilayer ceramic capacitors according to the inventiveexamples of the present invention and comparative examples wasmanufactured by the following method.

A ceramic slurry was prepared by mixing ethanol as an organic solvent,and ethyl cellulose as a binder, with a barium titanate powder, followedby ball milling using zirconia balls. The ceramic slurry was coated on apolyethylene film by a doctor blade method, and then dried, therebyforming ceramic green sheets.

A conductive paste was prepared by mixing ethanol as an organic solvent,and ethyl cellulose as a binder, with a nickel powder, followed by ballmilling.

Internal electrodes were, respectively, formed on the ceramic greensheets by using the conductive paste.

A ceramic green sheet laminate was manufactured by laminating theceramic green sheets on which the internal electrodes were formed, andthen the ceramic green sheet laminate was cut to provide a green chip.The number of laminated internal electrodes was 240, 250, and 260.

The green chip was sintered in a reduction atmosphere at a temperatureof 1000° C., thereby obtaining a sintered chip.

External electrodes were formed on the sintered chip by using aconductive paste containing copper as a main component, and thus, themultilayer ceramic capacitor was finally manufactured.

First, in order to confirm the appropriateness of the number oflaminated internal electrodes, multilayer ceramic capacitors weremanufactured while the number of laminated internal electrodes and theratio (T_(e)/T_(d)) of the thickness (T_(e)) of the internal electrode31 or 32 to the thickness (T_(d)) of the ceramic layer 11 were varied,and then ESL values thereof were measured. The results were tabulated inTable 1.

Specifically, the ESL values of the multilayer ceramic capacitors weremeasured while the number of laminated internal electrodes 31 or 32 wasvaried to 240, 250, and 260, and T_(e)/T_(d) was varied to 0.4, 0.6,1.0, and 1.4. The ESL value was measured by using a vector networkanalyzer (VNA), after a chip was mounted on a substrate.

TABLE 1 Number of laminated internal electrodes T_(e) T_(d) T_(e)/T_(d)ESL Sample 1 240 0.6 1.5 0.4 90 Sample 2 0.75 1.5 0.5 91 Sample 3 1.51.5 1 93 Sample 4 2.1 1.5 1.4 94 Sample 5 250 0.6 1.5 0.4 94 Sample 60.75 1.5 0.5 102 Sample 7 1.5 1.5 1 104 Sample 8 2.1 1.5 1.4 107 Sample9 260 0.6 1.5 0.4 96 Sample 10 0.75 1.5 0.5 103 Sample 11 1.5 1.5 1 106Sample 12 2.1 1.5 1.4 109

As shown in Table 1, in Samples 1 to 4 in which the number of laminatedinternal electrodes was 240 and T_(e)/T_(d) values were respectively0.4, 0.5, 1.0, and 1.4, ESL values thereof were 90 pH, 91 pH, 93 pH, and94 pH, respectively. The ESL values were relatively small regardless ofthe T_(e)/T_(d) values. The unit of ESL is picohenry “pH”.

Sample 5, in which the number of laminated internal electrodes was 250and the T_(e)/T_(d) value was 0.4, exhibited an ESL value of 94 pH;Sample 6, in which the number of laminated internal electrodes was 250and the T_(e)/T_(d) value was 0.5, exhibited an ESL value of 102 pH;Sample 7, in which the number of laminated internal electrodes was 250and the T_(e)/T_(d) value was 1.0, exhibited an ESL value of 104 pH; andSample 8, in which the number of laminated internal electrodes was 250and the T_(e)/T_(d) value was 1.4, exhibited an ESL value of 102 pH.

It may be confirmed from Samples 5 to 8 that the ESL value did notincrease when the number of laminated internal electrodes 31 and 32 was250 and the T_(e)/T_(d) value was 0.4, but the ESL abruptly increasedwhen the T_(e)/T_(d) value was 0.5 or greater.

Also, Samples 9 to 12, in which the number of laminated internalelectrodes was 260, had the same results as the cases in which thenumber of laminated internal electrodes was 250.

In conclusion, it may be confirmed from Table 1 above that the ESL valueabruptly increased when the number of laminated internal electrodes 31and 32 was 250 or more and the T_(e)/T_(d) value was 0.5 or greater.

Embodiments of the present invention may be provided to solve thedefects occurring in the cases in which the number of laminated internalelectrodes 31 and 32 was 250 or more and the T_(e)/T_(d) value was 0.5or greater.

Next, in order to confirm the appropriateness of the ratio (T_(a)/T_(m))of the thickness (T_(a)) of the side portion (B) to the thickness(T_(m)) of the central portion (E) in the width direction of the ceramicbody 10, the ESL value of each multilayer ceramic capacitor manufacturedby the above method was measured, and also the thicknesses (T_(a) andT_(m)) of the ceramic body, the thickness (T_(d)) of the ceramic layer,and the thickness (T_(e)) of the internal electrode were measured froman SEM image of the W-T cross section that is polished. Also, it wasobserved whether or not delamination occurred. The results were shown inTable 2.

Specifically, the ESL values of the multilayer ceramic capacitors weremeasured while the number of laminated internal electrodes was 270 andthe T_(e)/T_(d) value was varied to 0.5, 1.0, 2.0, and 2.2 while theT_(a)/T_(m) value was varied to 0.88, 0.90, 0.93, 0.96, and 0.98 foreach of the T_(e)/T_(d) values. The thickness (T_(d)) of the ceramiclayer and the thickness (T_(e)) of the internal electrode were measuredin the manner as described above.

TABLE 2 T_(e) T_(d) T_(e)/ T_(a) T_(m) T_(a)/ ESL Delam- (μm) (μm) T_(d)(μm) (μm) T_(m) (pH) ination Comparative 0.5 1 0.5 430 488 0.88 113 NoExample 1 Inventive 440 488 0.90 95 No Example 1 Inventive 455 488 0.9393 No Example 2 Inventive 470 488 0.96 91 No Example 3 Comparative 480488 0.98 90 Occurred Example 2 Comparative 1.0 1 1.0 520 590 0.88 114 NoExample 3 Inventive 530 590 0.90 94 No Example 4 Inventive 550 590 0.9392 No Example 5 Inventive 565 590 0.96 91 No Example 6 Comparative 580590 0.98 90 Occurred Example 4 Comparative 2.0 1 2.0 740 845 0.88 115 NoExample 5 Inventive 760 845 0.90 96 No Example 7 Inventive 790 845 0.9393 No Example 8 Inventive 810 845 0.96 92 No Example 9 Comparative 830845 0.98 91 Occurred Example 6 Comparative 2.2 1 2.2 790 896 0.88 117Occurred Example 7 Comparative 810 896 0.90 96 Occurred Example 8Comparative 830 896 0.93 94 Occurred Example 9 Comparative 860 896 0.9693 Occurred Example 10 Comparative 880 896 0.98 92 Occurred Example 11

Referring to Table 2, comparative example 1 having a T_(e)/T_(d) valueof 0.5 and a T_(a)/T_(m) value of 0.88 exhibited an ESL value of 113 pHand no delamination. This is likely that the thickness of the sideportion in the width direction of the ceramic body was remarkablydecreased due to strong compression, resulting in an increased currentpath and an increased ESL value, but delamination did not occur due tostrong compression.

Inventive examples 1 to 3 having T_(e)/T_(d) values of all 0.5 andT_(a)/T_(m) values of 0.90, 0.93 and 0.96, respectively, exhibited ESLvalues of 95 pH, 93 pH and 91 pH, respectively, and all no delamination.

Comparative example 2 having a T_(e)/T_(d) value of 0.5 and aT_(a)/T_(m) value of 0.98 exhibited an ESL value of 90 pH anddelamination. This is likely that weak compression leaded a smallincrease in current path and a small increase in ESL, but bindingstrength between the internal electrode and the ceramic layer, which areformed of different kinds of materials, is reduced, resulting indelamination.

Comparative example 3, inventive examples 4 to 6, and comparativeexample 4, which had the T_(e)/T_(d) values of all 1.0, exhibited thesame results as the cases in which the T_(e)/T_(d) value was 0.5.

Also, comparative example 5, inventive examples 7 to 9, and comparativeexample 6, which had the T_(e)/T_(d) values of all 2.0, exhibited thesame results as the cases in which the T_(e)/T_(d) value was 0.5.

All of comparative examples 7 to 11 having the T_(e)/T_(d) values of all2.2 exhibited delamination. It is likely that the stress generated dueto repetitive thermal expansion and thermal shrinkage of the internalelectrodes was relatively strong because the internal electrodes wererelatively thick, and thus, delamination occurred due to this stress.

In conclusion, when the number of laminated internal electrodes was 270and the T_(e)/T_(d) value and the T_(a)/T_(m) value were 0.6-2.0 and0.9-0.97, respectively, the ESL value was relatively small anddelamination did not occur.

As set forth above, according to the embodiments of the presentinvention, a multilayer ceramic electronic component having relativelylow equivalent series inductance (ESL) may be obtained.

While the present invention has been shown and described in connectionwith the embodiments, it will be apparent to those skilled in the artthat modifications and variations can be made without departing from thespirit and scope of the invention as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic electronic component,comprising: a ceramic body having external electrodes; and internalelectrodes disposed between ceramic layers within the ceramic body, whena direction in which the external electrodes are connected and extendedis denoted as a ┌width direction┘; a direction in which the internalelectrodes are laminated is denoted as a ┌thickness direction┘; and adirection perpendicular to the width direction and the thicknessdirection is denoted as a ┌length direction┘, the ceramic body having awidth smaller than a length thereof, the number of the internalelectrodes laminated being 250 or more, when the thickness of theceramic layer is denoted by T_(d) and the thickness of the internalelectrode is denoted by T_(e), 0.5≦T_(e)/T_(d)≦2.0, and when thethickness of a central portion in a width direction of the ceramic bodyis denoted by T_(m) and the thickness of each of side portions of theceramic body is denoted by T_(a), in a cross section in awidth-thickness direction of the ceramic body, 0.9≦T_(a)/T_(m)≦0.97. 2.The multilayer ceramic electronic component of claim 1, wherein thecentral portion in the width direction of the ceramic body is withinsections inside 15% of the width of the ceramic body on both sides of acenter of the ceramic body in the width direction.
 3. The multilayerceramic electronic component of claim 1, wherein the side portion of theceramic body is a section within 10% of the width of the ceramic bodyfrom each side of the ceramic body in the width direction.
 4. Themultilayer ceramic electronic component of claim 1, wherein the internalelectrode includes a capacitance formation portion forming capacitanceby overlapping the internal electrode and an adjacent internalelectrode, and a lead-out portion extended from a portion of thecapacitance formation portion and led out to an outside of the ceramicbody, the lead out portion being thicker than the capacitance formationportion.
 5. The multilayer ceramic electronic component of claim 1,wherein the external electrodes are extended onto side surfaces opposingeach other in the width direction of the ceramic body and onto portionsof the other surfaces adjacent to the side surfaces.
 6. The multilayerceramic electronic component of claim 1, wherein the thickness of theceramic layer is a thickness of the ceramic layer disposed between thecapacitance formation portions of adjacent internal electrodes.
 7. Themultilayer ceramic electronic component of claim 1, wherein thethickness of the internal electrode is a thickness of the capacitanceformation portion of the internal electrode.
 8. The multilayer ceramicelectronic component of claim 1, wherein the cross section in thewidth-thickness direction is located within sections inside 40% of thelength of the ceramic body on both sides of the center of the ceramicbody in the length direction.
 9. A method of manufacturing a multilayerceramic electronic component, the method comprising: preparing a cuboidgreen chip by laminating 250 or more layers of internal electrodes eachinterposed between ceramic layers, the cuboid green chip having asmaller width than a length thereof; compressing side portions in thewidth direction of the green chip such that a ratio of a thickness of acompressed portion to a thickness of an uncompressed portion is0.9-0.97; sintering the green chip; and forming external electrodes onside surfaces in the width direction of the sintered chip.
 10. Themethod of claim 9, wherein in the preparing of the green chip, adjacentinternal electrodes are exposed to opposing surfaces of the green chip,respectively.
 11. The method of claim 9, wherein in the preparing of thegreen chip, the internal electrode is formed such that a lead-outportion thereof is thicker than a capacitance formation portion thereof.12. The method of claim 9, wherein in the compressing, the compressionis performed in a lamination direction of the internal electrodes. 13.The method of claim 9, wherein in the forming of the externalelectrodes, the external electrodes are extended to portions of theother surfaces adjacent to the side surfaces in the width direction.